21^st Advanced Building Skins Conference & Expo
03-04 November 2026, Bern, Switzerland

The Advanced Building Skins Conference & Expo has been running for over 20 years and is the premier international event for innovative building envelopes.

Attracting architects, engineers and representatives from the construction industry makes this event the ideal place for productive networking with a wide mix of industry specialists from more than 50 countries across the world.

The event is held in English and will take place 03-04 November 2026 at the Kursaal Conference Centre in Bern, Switzerland.

Artificial Intelligence at the Advanced Building Skins Conference 2026

Architecture, Engineering, and Construction (AEC) industry works at the intersection of design intent, technical performance, regulatory compliance, and constructability—particularly when it comes to high-performance building envelopes. Every project demands careful coordination between geometry, materials, energy performance, detailing, and execution, often under tight schedules and evolving requirements. While BIM has become an essential tool in architectural and engineering practice, critical information related to façades and building skins is still frequently scattered across models, specifications, analysis tools, and disciplines. This fragmentation limits collaboration, slows decision-making, and makes it difficult to translate design intelligence consistently from concept to construction.

Artificial intelligence (AI) is emerging as a powerful complement to BIM, offering new ways for architects and engineers to integrate, analyze, and reuse project data across the entire lifecycle of the building envelope. By connecting BIM models with performance simulations, material data, specifications, cost parameters, and construction constraints, AI can act as a digital co-pilot—supporting façade design optimization, early clash detection, constructability checks, and real-time evaluation of thermal, structural, and environmental trade-offs.

From BIM to Intelligence: The Role of AI in Envelope Design

For design and engineering teams, this convergence of BIM and AI enables earlier insight, more informed decisions, and greater confidence when addressing increasingly complex façade systems. Conflicts can be identified sooner, performance targets validated earlier, and design alternatives assessed more efficiently. The result is higher-quality building envelopes that meet demanding requirements for energy efficiency, durability, sustainability, and resilience—while helping teams deliver projects more efficiently in a resource-constrained environment.

One of the main themes of this year’s Advanced Building Skins Conference is the application of Artificial Intelligence in the building industry. The conference will bring together leading engineers, architects, researchers, and technology developers who are shaping the future of AI-enabled design and engineering in the AEC sector. Join us to explore how these tools are being applied in practice.

Beyond AI, the conference programme will address a broad spectrum of advanced façade and envelope technologies, including the integration of solar technologies into the building envelope, dynamic and adaptive glazing systems, smart and responsive materials, innovative concrete technologies, daylight performance analysis, and many other cutting-edge topics shaping high-performance building design. The full conference programme will be published mid-April.

We look forward to welcoming you to the Advanced Building Skins Conference in November.

Exhibition and Sponsorship Opportunities

Besides the excellent networking opportunities you'll also benefit from high-calibre presentations and targeted marketing opportunities through our tailored exhibition and sponsorship programme.

Ensure visibility and exposure to an international audience and showcase your business in the building envelope market with our speaking slots, sponsorship packages and exhibition space. It’s the perfect way for you to network with those from across the world.

For more information, please visit our Sponsors & Exhibitors page.