Exhibition and Sponsorship Opportunities

Showcase your participation in the building envelope market and ensure visibility and exposure to an international audience at our Advanced Building Skins Conference & Expo which takes place each year in Bern, Switzerland.

We also have 100s of delegates taking part live in the conference via our webinar. A video of the sessions is available on-demand for one year post the event, which will increase your brand exposure significantly to thousands of potential customers from across the world, multiple times.

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Who attends

Become an exhibitor

With over 800 delegates at the event each year, an exhibition space is the perfect way to enable your brand to be seen. Present your products and services by taking a stand at our event and enjoy the benefit of face-to-face meetings with key representatives working in building envelopes from across the world.

The exhibition space is located right next to the conference halls where coffee breaks and lunches are served, so you’re sure to not be missed.

View the full list of Exhibition and Sponsorship Packages.

Become a sponsor

Increase your visibility through our following sponsorship opportunities:

  • Reach over 800 delegates by putting your company flyer on the delegate USB drive - given to all delegates upon registration
  • Get your company logo on our advertising materials and the conference program
  • Receive complimentary delegate tickets – impress and invite your clients or potential new clients
  • Place an advert in the conference proceedings

View the full list of Exhibition and Sponsorship Packages

Become a speaker

Raise your profile and attract new business by giving your own presentation to over 800 delegates at our international event.

View the full list of Exhibition and Sponsorship Packages

Our speakers

Our speakers are from architectural and engineering offices, façade companies, research institutes and universities. Below you will find a list of some of the architectural and engineering offices that have presented at our conference:

ABUD

Budapest

Adrian Smith + Gordon Gill

Chicago

Aedas Design Architects

London

AH Associates

Barcelona

Ai Engineering

Torino

AKT II Envelope

London

Allana Buick & Bers

Palo Alto

Amtech Solutions

Dallas

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